234

Y. Teng, W. Zhu, Q. Wang, Z. Zhang, H. Wang, B. Guo, Z. Yang, H. Gong, C. He, B. Qu, S. P. Feng, Y. Yong, Ultra-tough Copper-copper Bonding by Nano-oxide-dispersed Copper Nanomembranes, Advanced Science, accepted.

234

C. He, J. Zhou, R. Zhou, C. Chen, S. Jing, K. Mu, Y. T. Huang, C. C. Chung, S. J. Cherng, Y. Lu, K. N. Tu, S. P. Feng, Nanocrystalline Copper for Direct Copper-to-copper Bonding with Improved Cross-interface Formation at Low Thermal Budget, Nature Communications, 15, 7095, 2024.

234

C. Chen, S. J. Cherng, C. He, C. C. Chung, S. Wang, Y. T. Huang, S. P. Feng, Nanotwinning-assisted Structurally Stable Copper for Fine-pitch Redistribution Layer in 2.5D/3D IC Packaging, Journal of Materials Research and Technology, 27, 4883-4890, 2023.

234

Y. Wang, Y. T. Huang , Y. X. Liu, S. P. Feng , M. X. Huang, Thermal Instability of Nanocrystalline Cu Enables Cu-Cu Direct Bonding in Interconnects at Low Temperature, Scripta Materialia, 220, 114900, 2022.

234

Z. Xu, L. Wang, X. Huan, H. K. Lee, J. H. Yang, Z. Zhou, M. Chen, S. Hu, Y. Liu, S. P. Feng, T. Zhang, F. Xu, Z. Chu, J. T. Kim, On-demand, Direct Printing of Nanodiamonds at the Quantum Level, Advanced Science, 9, 2103598, 2022.

234

J. Yang, M. Chen, H. Lee, Z. Xu, Z. Zhou, S. P. Feng, J. T. Kim, Three-dimensional Printing of Self-assembled Dipeptides, ACS Applied Materials & Interfaces, 13, 20573-20580, 2021.

234

Z. Zheng, Y. T. Huang, Z. Wang, M. Zhang, W. T. Wang, C. C. Chung, S. J. Cherng, Y. H. Tsai, P. C. Li, Z. Lu, C. M. Chen, S. P. Feng, Electrodeposition of (111)-oriented and Nanotwin-doped Nanocrystalline Cu with Ultrahigh Strength for 3D IC Application, Nanotechnology, 32, 225702, 2021.

234

P. C. Chiang, Y. A. Shen, S. P. Feng, C. M. Chen, Electrodeposition of Twinned Cu with Strong Texture Effect on Voiding Propensity in Electroplated Cu Solder Joints, Journal of The Electrochemical Society, 167, 162516, 2021. 

234

P. Swetha, J. Chen, A. S. Kumar, S. P. Feng, High index facets-Ag nanoflower enabled efficient electrochemical detection of lead in blood serum and cosmetics, Journal of Electroanalytical Chemistry, 878, 114657, 2020.

234

J. N. Liu, M. C. Sil, R. Cheng, S. P. Feng, C. M. Chen, Surface silanization of polyimide for autocatalytic metallization, The Journal of The Minerals, Metals & Materials Society (JOM), 72, 3529-3537, 2020. 

234

B. Peng, X. Ji, M. Chu, J. Liu, Y. Li, M. Chen, Z. Zhou, C. Zhang, Q. Miao, H. Dong, B. Huang, W. Hu, S. P. Feng, W. D. Li, K. L. Chan, A Transfer Method for Organic Semiconductor Towards High-mobility, Bias-stable, and Flexible Field Effect Transistors, Advanced Materials Technologies, 5, 2000169, 2020.

234

J. Chen, Z. Wang, J. Mao, C. Liu, Z. Lu, Y. Chen, S.P. Feng, Bimetallic Ag-Cu Nanosheets Assembled Flower-like Structure for Oxygen Reduction Reaction, Journal of Alloys and Compounds, 856, 157379, 2020. 

234

A. Khan, C. Liang, Y. T. Huang, C. Zhang, J. Cai, S. P. Feng, W. D. Li, Template‐Electrodeposited and Imprint-transferred Microscale Metal-mesh Transparent Electrodes for Flexible and Stretchable Electronics, Advanced Engineering Materials, 21, 1900723, 2019.

234

Z. Zhou, Q. Wu, S. Wang, Y. T. Huang, H. Guo, S.P. Feng, P.K.L. Chan, Field-effect Transistors Based on Two-dimensional Organic Semiconductors Developed by a Hybrid Deposition Method, Advanced Science, 6, 1900775, 2019.

234

C. Liu, Q. Song, J. Chen, X. Li, J. Cai, Z. Lu, W. D. Li, N. X. Fang, S. P. Feng, Electromagnetic and Chemical Enhancements of Surface-enhanced Raman Scattering Spectra from Cu2O Hexagonal Nanoplates, Advanced Materials Interfaces, 6, 1900534, 2019.

234

S. T. Tsai, P. C. Chiang, C. Liu, S. P. Feng, C. M. Chen, Suppression of Void Formation at Sn/Cu Joint Due to Twin Formation in Cu Electrodeposit, The Journal of The Minerals, Metals & Materials Society (JOM), 71, 3012-3022, 2019. 

234

Z. Zheng, P. C. Chiang, Y. T. Huang, W. T. Wang, P. C. Li, Y. H. Tsai, C. M. Chen, S. P. Feng, Study of Grain Size Effects of Cu Metallization on Interfacial Microstructures of Solder Joints, Microelectronics Reliability, 99, 44-51, 2019.

234

J. Cai, M. Zhang, Z. Sun, C. Zhang, C. Liang, A. Khan, X. Ning, H. Ge, S. P. Feng, W. D. Li, Highly-facile Template-based Selective Electroless Metallization of Micro- and Nanopatterns for Plastic Electronics and Plasmonics, Journal of Materials Chemistry C, 7, 4363-4373, 2019.

234

Z. Yang, X. Huang, X. Ma, Z. Zhou, H. Guo, Z. Yao, S. P. Feng, C. Y. Tang, Fabrication of a Novel and Green Thin-film Composite Membrane Containing Nanovoids for Water Purification, Journal of Membrane Science, 570, 314-321, 2019.

234

J. Chen, C. Liu, Y. T. Huang, H. Lee, S. P. Feng, Study of the Growth Mechanisms of Nanoporous Ag Flowers for Non-enzymatic Glucose Detection, Nanotechnology, 29, 505501, 2018 (Featured as front cover).

234

P. Swetha, S. P. Feng, High-index Facet Defined Shaped-controlled Electrochemical Synthesis of Nanocrystals, Electrochemistry Communications, 94, 64-69, 2018.

234

K. W. Kwan, S. J. Li, N. Y. Hau, W. D. Li, S. P. Feng, A. H. W. Ngan, Light-stimulated Actuators Based on Nickel Hydroxide-oxyhydroxide, Science Robotics, 3, eaat4051, 2018.

234

Y. C. Tseng, H. Lee, N. Y. Hau, S. P. Feng, C. M. Chen,  Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-coated Bi2Te3, Journal of Electronic Materials, 47, 27-34, 2018.

234

Y. H. Chang, C. Liu, S. Rouvimov, T. Luo, S. P. Feng, Electrochemical Synthesis to Convert a Ag Film to Ag Nanoflowers with High Electrocatalytic Activity, Chemical Communications, 53, 6752-6755, 2017.

234

C. F. Lin, N. Y. Hau, Y. T. Huang, Y. H. Chang, S. P. Feng, C. M. Chen, Synergetic Effect of Bi2Te3 Alloys and Electrodeposition of Ni for Interfacial Reactions at Solder/Ni/Bi2Te3 Joints, Journal of Alloys and Compounds, 708, 220-230, 2017.

234

N. Y. Hau, P Yang, P. H. Lee, S. P. Feng, Aminosilane-assisted Electrodeposition of Gold Nanodendrites and Their Catalytic Properties, Scientific Reports, 7, 39839, 2017.

234

X. Ji, H. Y. Lau, X. Ren, B. Peng, P. Zhai, S. P. Feng, P. K. L. Chan, Bioelectronics: Highly Sensitive Metabolite Biosensor Based on Organic Electrochemical Transistor Integrated with Microfluidic Channel and Poly(N-vinyl-2-pyrrolidone)-capped Platinum Nanoparticles, Advanced Materials Technologies, 1, 1600042, 2016.

234

K. C. Lai, P. Y. Wu, C. M. Chen, T. C. Wei, C. H. Wu, S. P. Feng, Interfacial Characterizations of a Nickel-phosphorus Layer Electrolessly Deposited on a Silane Compound-modified Silicon Wafer under Thermal Annealing, Journal of Electronic Materials, 45, 4813-4822, 2016.

234

C. Liu, H. Lee, Y. H. Chang, S. P. Feng, The Study of Electrical Conductivity and Diffusion Behavior of Water-based and Ferro/ferricyanide-electrolyte-based Alumina Nanofluids, Journal of Colloid and Interface Science, 469, 17-24, 2016.

234

Y. H. Chang, C. Liu, S. P. Feng, Electrochemical Fabrication of Metal Nanostructures by Using a Hydrophilic/hydrophobic Sponge-like NiOOH/Ni(OH)2 Template, Thin Solid Films, 603, 1-7, 2016. 

234

Y. H. Chang, S. P. Feng, Stepwise Anodic Electrodeposition of Nanoporous NiOOH/Ni(OH)2 with Controllable Wettability and its Applications, HKIE Transactions, 22, 202-211, 2015. (HKIE outstanding paper award)

234

Y. Cai, H. E. Wang, M. J. Xu, Y. Yu, J. Jin, R. L. Zhang, Y. Li, S. P. Feng, B. L. Su, Hierarchically Structured Porous TiO2 Microspheres Constructed by Interconnected Coarse Nanorods as High-performance Lithium-ion Battery Anode, Chemical Engineering Journal, 281, 844-851, 2015.

234

H. T. Yu, T. C. Wei, P. Zhai, S. P. Feng, M. Ikegami, T. Miyasaka, A Room-temperature Process for Fabricating a Nano-Pt Counter Electrode on a Plastic Substrate for Efficient Dye-sensitized Cells, Journal of Power Sources, 283, 351-357, 2015.

234

N. Y. Hau, Y. H. Chang, S. P. Feng, Kinetics Study of Silver Electrocrystallization on (3-mercaptopropyl)Trimethoxysilane-grafted Indium Tin Oxide Plastic Substrate, Electrochimica Acta, 158, 121-128, 2015.

234

Y. H. Chang, N. Y. Hau, C. Liu, Y. T. Huang, C. C. Li, K. Shih, S. P. Feng, A Short-range Ordered-disordered Transition of NiOOH/Ni(OH)2 Pair Induces Switchable Wettability, Nanoscale, 6, 15309-15315, 2014.

234

F. Xie, S. J. Cherng, S. Lu, Y. H. Chang, W. E. I. Sha, S. P. Feng, C. M. Chen, W. C. H. Choy, Functions of Self-assembled Ultrafine TiO2 Nanocrystals for High Efficient Dye-sensitized Solar Cells, ACS Applied Materials & Interfaces, 6, 5367-5373, 2014.

234

Z. Wang, C. Fan, X. Ren, Y. H. Chang, H. Li, S. P. Feng, S. Shi, P. K. L. Chan, Low Cost Universal High-k Dielectric for Solution Processing and Thermal Evaporation Organic Transistors, Advanced Materials Interfaces, 1, 1300119-1300125, 2014.

234

N. Y. Hau, Y. H. Chang, Y. T. Huang, T. C. Wei, S. P. Feng, Direct Electroplated Metallization on Indium Tin Oxide Plastic Substrate, Langmuir, 30, 132-139, 2014.

234

Y. H. Chang, Y. T. Huang, M. K. Lo, C. F. Lin, C. M. Chen, S. P. Feng, Electrochemical Fabrication of Transparent Nickel Hydroxide Nanostructures with Tunable Superhydrophobicity/Superhyrophilicity for 2D Microchannels Application, Journal of Materials Chemistry A, 2, 1985-1990, 2014.

234

H. K. Cheng, S. P. Feng, Y. J. Lai, K. C. Liu, Y. L. Wang, T. F. Liu, C. M. Chen, Effect of Polyimide Baking on Bump Resistance in Flip-chip Solder Joints, Microelectronics Reliability, 54, 629-632, 2014.

234

H. Su, J. Zhang, W. Ma, K. Wei, L. Liu, H. Fu, S. P. Feng, A. K. Soh, In-situ Fabrication of Highly Dense Nanoeutectic Al2O3/YAG Composite Ceramics by a Modified Laser Surface Processing, Journal of the European Ceramic Society, 34, 739-744, 2014.

234

H. P. Feng, T. Paudel, B. Yu, S. Chen, Z. F. Ren, G. Chen, Nanoparticle-enabled Selective Electrodeposition, Advanced Materials, 23, 2454-2459, 2011. 

234

H. P. Feng, B. Yu, S. Chen, K. Collins, C. He, Z. F. Ren, G. Chen, Studies on Surface Preparation and Smoothness of Nanostructured Bi2Te3-based Alloys by Electrochemical and Mechanical Methods, Electrochimica Acta, 56, 3079-3084, 2011.

234

M. Y. Cheng, K. W. Chen, T. F. Liu, Y. L. Wang, H. P. Feng, Effects of Direct Current and Pulse-reverse Copper Plating Waveforms on the Incubation Behavior of Self-annealing, Thin Solid Films, 518, 7468-7474, 2010.

234

H. P. Feng, J. Y. Lin, Y. Y. Wang, C. C. Wan, Effect of Light Illumination for Copper Oxidation After Chemical Mechanical Polishing, Journal of the Electrochemical Society, 155, H620-624, 2008.

234

H. P. Feng, J. Y. Lin, M. Y. Cheng, Y. Y. Wang, C. C. Wan, Behavior of Copper Removal by CMP and its Correlation to Deposit Structure and Impurity Content, Journal of the Electrochemical Society, 155, H21-25, 2008.

234

J. Y. Lin, C. C. Wan, Y. Y. Wang, H. P. Feng, Void Defect Reduction after Chemical Mechanical Planarization of Trenches Filled by Direct/Pulse Plating, Journal of the Electrochemical Society, 154, D139-144, 2007.

234

J. Y. Lin, Y. Y. Wang, C. C. Wan, H. P. Feng, M. Y. Cheng, Impurity Induced Localized Corrosion Between Copper and Tantalum Nitride during Chemical Mechanical Planarization, Electrochemical and Solid-State Letters, 10, H23-26, 2007.

234

H. P. Feng, M.Y. Cheng, Y. L. Wang, S. C. Chang, Y. Y. Wang, C.C. Wan, Mechanism for Cu Void Defect on Various Electroplated Film Conditions, Thin Solid Films, 498, 56-59, 2006.

234

C. W. Liu, Y. L. Wang, M. S. Tsai, H. P. Feng, S. C. Chang, G. J. Hwang, Effect of Plating Current Density and Annealing on Impurities in Electroplated Cu film, Journal of Vacuum Science & Technology A, 23, 658-662, 2005.

234

H. P. Feng, Y. Wu, Y. Y. Wang, C. C. Wan, Electroless Cu Deposition Process on TiN for ULSI Interconnect Fabrication via Pd/Sn Colloid Activation, Journal of Electronic Materials, 32, 9-17, 2003. 

234

Y. Wu, W. C. Chen, H. P. Feng, C. C. Wan, Y. Y. Wang, Displacement Reaction between Metal Ions and Nitride Barrier Layer/silicon Substrate, Journal of the Electrochemical Society, 149, G309-317, 2002.